Item order

category

Specifications

one

area of application

Special machine for defoaming and high temperature curing after semiconductor die bonding.

2

power

Total power of equipment

7KVA

Power Supply 

AC380V  3φ  50HZ  

inside measurement

Pressure barrel size

600×D600mm in diameter

Product placement area

W420*D600*H420mm

Outer Dimensions

W1380mm×D1600mm×1540mm (reference size)

four

Equipment structure

1. Single-box round barrel structure design is adopted, and the electric control box is located on the right side of the machine.

2. The jacketed electric heater is used to circularly heat the micro-high pressure gas circulating in the furnace, and then the ventilation function and exhaust gas are completed through forced pressurization and automatic circulating pressure relief outside the furnace, so as to maintain the gas pressure in the furnace relatively higher than the external pressure; When the gas temperature in the furnace reaches the set value, the heater will automatically stop heating, and when the temperature in the furnace is lower than the set value, the heater will automatically start to maintain the temperature stability in the furnace!

3. Vertical, the fan is located at the back of the box, and it supplies air horizontally.

6.1 set of heating control, heater and hot air circulation system are located at the back of the box.

7. One circulating fan with power of 750W.

five

Materials and standards

1. SUS304#5.0mm stainless steel plate with concave iron reinforcement is used inside.

2. The exterior is made of SUS41# cold-rolled steel plate. The antistatic powder is painted with beige wrinkles.

3. High-grade thermal insulation cotton is used, the thickness of thermal insulation layer is 90 mm, and thermal insulation board is added.

4. High-temperature resistant silicone rubber is used for pressing, and the temperature resistance is ≥260℃.

5. Adopt powerful rotary door buckle, which can adjust American back twist.

six

Pressurization system

1. Positive pressure structure design, the furnace can bear 8 kilograms of positive pressure.

2. Install pressure regulating valve, pressure relief valve, digital display pressure gauge and equipped with gas pressure protection and high-pressure alarm to make an appointment to start and stop.

3. Safety door protection, the door can not be pressurized if it is not closed tightly, and the door can not be opened if the pressure in the furnace is less than normal pressure. Manual pressure relief and automatic pressure relief are combined.

seven

Negative pressure system

Vacuum range:-0.090 ~ 0.1 MPa

Pumping rate: 8L/s. 。

Vacuum degree ≤133pa

Leakage rate ≤0.001pa/L/S

six

Temperature parameter

temperature range

Normal temperature ~ 250℃

heating rate

≥8℃/min

Overtemperature control

XZ-480 overtemperature protector

Sensor temperature sensing accuracy

±0.3℃

Uniformity

±2%℃

Cooling rate

200℃→60℃≥6℃/min

Cooling rate

Usually at 200℃, it is less than or equal to room temperature+10℃, except for the four sides of the oven door and the exhaust port.